Monroeville, PA   |   Murrysville, PA(412) 373-8110

澳洲幸运10注册平台

Chip Carriers and Multi-Chip Modules

High density packaging for the most complex die

Specifications

Layers: 4
Trace/Space: 3/2 (75/50 µm)
                         Board Features:Electrolytic Ni/Au
                         Bonded Heat Spreader
                         Edge Plating
                         Blind Microvias
Material: High Tg FR4